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| TC2054/2055/2186 50mA, 100mA, and 150mA CMOS LDOs with Shutdown and Error Output Features * Very Low Supply Current (55A Typ.) for Longer Battery Life * Very Low Dropout Voltage: 140mV (Typ.) @ 150mA * High Output Voltage Accuracy: 0.4% (Typ) * Standard or Custom Output Voltages * Power-Saving Shutdown Mode * ERROR Output Can Be Used as a Low Battery Detector or Processor Reset Generator * Fast Shutdown Reponse Time: 60sec (Typ) * Over-Current Protection * Space-Saving 5-Pin SOT-23A Package * Pin Compatible Upgrades for Bipolar Regulators General Description The TC2054, TC2055 and TC2186 are high accuracy (typically 0.4%) CMOS upgrades for older (bipolar) low dropout regulators. Designed specifically for battery-operated systems, the devices' total supply current is typically 55A at full load (20 to 60 times lower than in bipolar regulators). The devices' key features include ultra low noise operation, very low dropout voltage - typically 45mV (TC2054); 90mV (TC2055); and 140mV (TC2186) at full load - and fast response to step changes in load. An error output (ERROR) is asserted when the devices are out-of-regulation (due to a low input voltage or excessive output current). Supply current is reduced to 0.5A (max) and both VOUT and ERROR are disabled when the shutdown input is low. The devices also incorporate over-current protection. The TC2054, TC2055 and TC2186 are stable with a low esr ceramic output capacitor of 1F and have a maximum output current of 50mA, 100mA and 150mA, respectively. This LDO Family also features a fast response time (60sec typically) when released from shutdown. Applications * * * * * * Battery Operated Systems Portable Computers Medical Instruments Instrumentation Cellular / GSMS / PHS Phones Pagers Typical Application 1 5 1F Device Selection Table Part Number TC2054-xxVCT TC2055-xxVCT TC2186-xxVCT Note: Package 5-Pin SOT-23A* 5-Pin SOT-23A* 5-Pin SOT-23A* Junction Temp. Range -40C to +125C -40C to +125C -40C to +125C 2 GND VIN VIN VOUT VOUT 1F *5-Pin SOT-23A is equivalent to EIAJ (SC-74A). 3 Shutdown Control (from Power Control Logic) SHDN TC2054 TC2055 TC2186 4 1M Package Type VOUT 5 ERROR 4 ERROR ERROR TC2054 TC2055 TC2186 1 2 3 VIN GND SHDN 5-Pin SOT-23A* TOP VIEW 2002 Microchip Technology Inc. DS21663B-page 1 (c) TC2054/2055/2186 1.0 ELECTRICAL CHARACTERISTICS *Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods my affect device reliability. ABSOLUTE MAXIMUM RATINGS* Input Voltage .........................................................6.5V Output Voltage................................(-0.3) to (VIN + 0.3) Operating Temperature .................. -40C < TJ< 125C Storage Temperature.......................... -65C to +150C Maximum Voltage on Any Pin ........ VIN +0.3V to -0.3V TC2054/2055/2186 ELECTRICAL SPECIFICATIONS Electrical Characteristics: VIN = VR + 1V, IL = 100A, CL = 3.3F, SHDN > VIH, TA = 25C, unless otherwise noted. BOLDFACE type specifications apply for junction temperature of -40C to +125C. Symbol VIN IOUTMAX Parameter Input Operating Voltage Maximum Output Current Min 2.7 50 100 150 VR - 2.0% -- -- -- -1.5 -2.5 -- -- -- -- -- -- -- 160 -- -- -- Typ -- -- -- -- VR 0.4% 20 40 0.05 0.5 0.5 2 45 90 140 55 0.05 50 300 0.04 600 60 Max 6.0 -- -- -- VR + 2.0% -- -- 0.5 0.5 0.5 -- 70 140 210 80 0.5 -- -- -- -- -- Units V mA Note 1 TC2054 TC2055 TC2186 Note 2 Test Conditions VOUT TCVOUT VOUT/ VIN VOUT/ VOUT VIN - VOUT Output Voltage VOUT Temperature Coefficient Line Regulation Load Regulation V ppm/C Note 3 % % (VR + 1V) < VIN < 6V TC2054;TC2055 TC2186 Note 4 IL = 0.1mA to IOUTMAX IL = 0.1mA to IOUTMAX IL = 100A IL = 50mA IL = 100mA IL = 150mA Dropout Voltage, Note 5 mV TC2015; TC2185 TC2185 Note 5 A A dB mA V/W nV / Hz sec SHDN = VIH, IL=0 SHDN = 0V FRE 120kHz VOUT = 0V Note 6 IIN IINSD PSRR IOUTSC VOUTPD eN tR Supply Current Shutdown Supply Current Power Supply Rejection Ratio Output Short Circuit Current Thermal Regulation Output Noise Response Time (from Shutdown Mode) 1: 2: 3: IL = IOUTMAX, F = 10kHz VIN = 4V CIN = 1F, COUT = 10F IL = 0.1mA, Note 9 Note The minimum VIN has to meet two conditions: VIN = 2.7V and VIN = VR + VDROPOUT. VR is the regulator output voltage setting. For example: VR = 1.8V, 2.7V, 2.8V, 2.85V, 3.0V, 3.3V. 6 TCVOUT = ( V OU TMAX - VOUTMIN ) x 10 ----------------------------------------------------------------------------------------V x T OUT 4: 5: 6: 7: 8: 9: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 1.0mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value at a 1V differential. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to IMAX at VIN = 6V for T = 10msec. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e. TA, TJ, JA). Hysteresis voltage is referenced by VR. Time required for VOUT to reach 95% of VR (output voltage setting), after VSHDN is switched from 0 to VIN. (c) DS21663B-page 2 2002 Microchip Technology Inc. TC2054/2055/2186 Electrical Characteristics: VIN = VR + 1V, IL = 100A, CL = 3.3F, SHDN > VIH, TA = 25C, unless otherwise noted. BOLDFACE type specifications apply for junction temperature of -40C to +125C. Symbol SHDN Input VIH VIL VINMIN VOL VTH VHYS tDELAY RERROR Note 1: 2: 3: SHDN Input High Threshold SHDN Input Low Threshold 60 -- -- -- -- 15 %VIN %VIN V mV V mV msec VIN = 2.5V to 6.0V VIN = 2.5V to 6.0V VOUT 2.7V 1 mA Flows to ERROR See Figure 4-2 Note 8 VOUT from VR = 3V to 2.8V VDD = 2.5V, VOUT = 2.5V Parameter Min Typ Max Units Test Conditions ERROR OUTPUT Minimum VIN Operating Voltage Output Logic Low Voltage ERROR Threshold Voltage ERROR Positive Hysteresis VOUT to ERROR Delay Resistance from ERROR to GND 1.0 -- -- -- -- -- -- -- 0.95 x VR 50 2 126 -- 400 -- -- -- -- The minimum VIN has to meet two conditions: VIN = 2.7V and VIN = VR + VDROPOUT. VR is the regulator output voltage setting. For example: VR = 1.8V, 2.7V, 2.8V, 2.85V, 3.0V, 3.3V. TCVOUT = 6 (V -V ) x 10 OU TMAX OUTMIN ----------------------------------------------------------------------------------------V OUT x T 4: 5: 6: 7: 8: 9: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 1.0mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value at a 1V differential. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to IMAX at VIN = 6V for T = 10msec. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e. TA, TJ, JA). Hysteresis voltage is referenced by VR. Time required for VOUT to reach 95% of VR (output voltage setting), after VSHDN is switched from 0 to VIN. 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: Pin Number 1 2 3 PIN FUNCTION TABLE Symbol VIN GND SHDN Unregulated supply input. Ground terminal. Shutdown control input. The regulator is fully enabled when a logic high is applied to this input. The regulator enters shutdown when a logic low is applied to this input. During shutdown, output voltage falls to zero, ERROR is open circuited and supply current is reduced to 0.5A (max). Out-of-Regulation Flag. (Open drain output). This output goes low when VOUT is out-of-tolerance by approximately -5%. Regulated voltage output. Description 4 5 ERROR VOUT 2002 Microchip Technology Inc. DS21663B-page 3 (c) TC2054/2055/2186 3.0 DETAILED DESCRIPTION FIGURE 3-2: VOUT VTH HYSTERESIS (VHYS) ERROR OUTPUT OPERATION The TC2054, TC2055 and TC2186 are precision fixed output voltage regulators. (If an adjustable version is desired, please see the TC1070, TC1071 or TC1187 data sheets.) Unlike bipolar regulators, the TC2054, TC2055 and TC2186 supply current does not increase with load current. In addition, VOUT remains stable and within regulation over the entire 0mA to maximum output current operating load range. Figure 3-1 shows a typical application circuit. The regulator is enabled any time the shutdown input (SHDN) is at or above V IH, and shutdown (disabled) when SHDN is at or below VIL. SHDN may be controlled by a CMOS logic gate, or I/O port of a microcontroller. If the SHDN input is not required, it should be connected directly to the input supply. While in shutdown, supply current decreases to 0.05A (typical), V OUT falls to zero volts, and ERROR is open-circuited. FIGURE 3-1: TYPICAL APPLICATION CIRCUIT VIN 1F VOUT 1F C1 GND VOUT ERROR VIH VOL 3.2 Output Capacitor BATTERY TC2054 TC2055 TC2186 V+ ERROR R1 1M BATTLOW or RESET SHDN Shutdown Control (to CMOS Logic or Tie to VIN if unused) A 1F (min) capacitor from VOUT to ground is required. The output capacitor should have an effective series resistance of 0.01. to 5 for VOUT = 2.5V, and 0.05. to 5 for VOUT < 2.5V. A 1F capacitor should be connected from VIN to GND if there is more than 10 inches of wire between the regulator and the AC filter capacitor, or if a battery is used as the power source. Ceramic, tantalum and aluminum electrolytic capacitors can be used. (Since many aluminum electrolytic capacitors freeze at approximately -30C, solid tantalums are recommended for applications operating below -25C). When operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques. C2 Required Only if ERROR is used as a Processor RESET Signal (See Text) 0.2F C2 3.1 ERROR Open Drain Output ERROR is driven low whenever VOUT falls out of regulation by more than -5% (typical). This condition may be caused by low input voltage, output current limiting or thermal limiting. The ERROR threshold is 5% below rated VOUT regardless of the programmed output voltage value (e.g. ERROR = VOL at 4.75V (typ.) for a 5.0V regulator and 2.85V (typ.) for a 3.0V regulator). ERROR output operation is shown in Figure 4-2. Note that ERROR is active when V OUT falls to VTH, and inactive when VOUT rises above VTH by VHYS. As shown in Figure 3-1, ERROR can be used as a battery low flag or as a processor RESET signal (with the addition of timing capacitor C2). R1 x C2 should be chosen to maintain ERROR below VIH of the processor RESET input for at least 200msec to allow time for the system to stabilize. Pull-up resistor R1 can be tied to VOUT, VIN or any other voltage less than (VIN + 0.3V). The ERROR pin sink current is self-limiting to approximately 18mA. (c) DS21663B-page 4 2002 Microchip Technology Inc. TC2054/2055/2186 4.0 4.1 THERMAL CONSIDERATIONS Power Dissipation Equation 4-1 can be used in conjunction with Equation 4-2 to ensure regulator thermal operation is within limits. For example: Given: VINMAX VOUTMIN TAMAX = 3.0V 5% = 2.7V - 2.5% = 55C The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. The following equation is used to calculate worst case power dissipation: ILOADMAX = 40mA EQUATION 4-1: PD (VIN - V OUTMIN)ILOADMAX Where: PD VINMAX VOUTMIN = = = Worst case actual power dissipation Maximum voltage on VIN Minimum regulator output voltage Maximum output (load) current Find 1. Actual power dissapation : 2. Maximum allowable dissapation Actual power dissipation: PD (VINMAX - V OUTMIN)ILOADMAX = [(3.0 x 1.05) - (2.7 x .975)]40 x 10-3 = 20.7mW The maximum allowable power dissipation (Equation 4-2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (125 C) and the thermal resistance from junction-to-air (JA). The 5-Pin SOT-23A package has a JA of approximately 220C/Watt when mounted on a typical two layer FR4 dielectric copper clad PC board. Maximum allowable power dissipation: ( TJ - TA ) M AX MAX = ------------------------------------ JA ILOADMAX = PD MAX EQUATION 4-2: TJ - TA M AX MAX = --------------------------------- JA ( 125 - 55 ) -------------------------220 = 318mW In this example, the TC2054 dissipates a maximum of only 20.7mW; far below the allowable limit of 318mW. In a similar manner, Equation 4-1 and Equation 4-2 can be used to calculate maximum current and/or input voltage limits. PD MAX Where all terms are previously defined 4.2 Layout Considerations The primary path of heat conduction out of the package is via the package leads. Therefore, layouts having a ground plane, wide traces at the pads, and wide power supply bus lines combine to lower JA and, therefore, increase the maximum allowable power dissipation limit. 2002 Microchip Technology Inc. DS21663B-page 5 (c) TC2054/2055/2186 5.0 Note: TYPICAL CHARACTERISTICS The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. POWER SUPPLY REJECTION RATIO IOUT = 100A COUT = 1mF Ceramic -20 FIGURE 5-1: 0 FIGURE 5-4: 0 POWER SUPPLY REJECTION RATIO IOUT = 150mA COUT = 10F Ceramic VINDC = 4V VINAC = 100mVp-p VOUTDC = 3V VINDC = 4V VINAC = 100mVp-p VOUTDC = 3V -20 PSRR (dB) PSRR (dB) -40 -40 -60 -60 -80 -80 -100 10 100 1k 10k 100k 1M -100 10 100 1k 10k 100k 1M f (Hz) f (Hz) FIGURE 5-2: 0 POWER SUPPLY REJECTION RATIO IOUT = 150mA COUT = 1F Ceramic FIGURE 5-5: 0 POWER SUPPLY REJECTION RATIO IOUT = 150mA COUT = 10F Tantalum VINDC = 4V VINAC = 100mVp-p VOUTDC = 3V VINDC = 4V VINAC = 100mVp-p VOUTDC = 3V -20 -20 PSRR (dB) PSRR (dB) -40 -40 -60 -60 -80 -80 -100 10 100 1k 10k 100k 1M -100 10 100 1k 10k 100k 1M f (Hz) f (Hz) FIGURE 5-3: 10 OUTPUT NOISE FIGURE 5-6: 0.160 VOUT = 1.8V 0.140 DROPOUT VOLTAGE VS. ILOAD 1 Noise (mV/Hz) 0.120 0.100 T = 25C T = 130C T = -45C 0.1 COUT = 1F DOV (V) 100 1000 0.080 0.060 0.01 0.040 0.020 0.001 0.01 0.1 1 10 Frequency (KHz) 0.000 0 50 100 150 ILOAD (mA) (c) DS21663B-page 6 2002 Microchip Technology Inc. TC2054/2055/2186 TYPICAL CHARACTERISTICS (CONT) FIGURE 5-7: 65.00 VOUT = 1.8V 63.00 IDD VS. TEMPERATURE FIGURE 5-10: OUTPUT VOLTAGE VS. OUTPUT CURRENT 1.9 1.88 1.86 61.00 IDD (mA) 1.84 VIN = 2.8V VOUT (V) 59.00 1.82 1.8 1.78 1.76 VIN = 2.8V 57.00 55.00 1.74 1.72 53.00 -45 5 55 105 155 1.7 0 15 30 45 60 75 ILOAD (mA) 90 105 120 135 150 Temp (C) FIGURE 5-8: 2.9 2.85 2.8 2.75 VOUT (V) VOUT = 2.8V IOUT = 0.1mA OUTPUT VOLTAGE VS. TEMPERATURE FIGURE 5-11: OUTPUT VOLTAGE VS. SUPPLY VOLTAGE 2.9 VOUT = 2.8V IOUT = 0.1mA Temp = +130C VIN = 6.5V 2.85 VIN = 6.0V VIN = 3.8V 2.8 2.75 VOUT (V) Temp = -45C Temp = +25C 2.7 2.65 2.6 2.55 2.5 -50 -35 -20 -5 10 25 40 55 70 85 100 115 130 145 2.7 2.65 2.6 2.55 2.5 3.5 4 4.5 5 VIN (V) 5.5 6 6.5 7 Temperature (C) FIGURE 5-9: 1.9 1.88 1.86 1.84 VOUT = 1.8V IOUT = 0.1mA OUTPUT VOLTAGE VS. TEMPERATURE FIGURE 5-12: OUTPUT VOLTAGE VS. SUPPLY VOLTAGE 1.9 1.88 VOUT = 1.8V IOUT = 0.1mA VIN = 6.0V VOUT (V) 1.82 1.8 1.78 VIN = 6.5V 1.86 1.84 VOUT (V) 1.82 1.8 1.78 1.76 Temp = +130C VIN = 2.8V 1.76 1.74 1.72 Temp = +25C Temp = -45C 1.74 1.7 -50 -35 -20 -5 10 25 40 55 70 85 100 115 130 145 1.72 1.7 Temperature (C) 2.7 3.2 3.7 4.2 4.7 VIN (V) 5.2 5.7 6.2 6.7 2002 Microchip Technology Inc. DS21663B-page 7 (c) TC2054/2055/2186 TYPICAL CHARACTERISTICS (CONT) FIGURE 5-13: LOAD TRANSIENT RESPONSE V IN = 3.8V VOUT = 2.8V C IN = 1 F Ceramic C OUT= 1 F Ceramic Frequency = 1 KHz FIGURE 5-16: LOAD TRANSIENT RESPONSE V IN = 3.0V VOUT = 2.8V C IN = 1F Ceramic C OUT= 10F Ceramic Frequency = 10KHz 100mV/DIV V OUT 100mV / DIV V OUT Load Current Load Current 150mA Load 100A 150mA Load 100A FIGURE 5-14: LOAD TRANSIENT RESPONSE IN DROPOUT MODE Load Transient Response in Dropout Mode FIGURE 5-17: SHUTDOWN DELAY V IN = 4.0V VOUT = 3.0V C OUT = 10F C BYP = 0.01F I OUT = 100A VOUT 100mV/DIV V SHDN 150mA VIN = 3.105V VOUT = 3.006V CIN = 1F Ceramic COUT = 1F Ceramic RLOAD = 20 V OUT 100A FIGURE 5-18: SHUTDOWN WAKE-UP TIME FIGURE 5-15: LINE TRANSIENT RESPONSE V SHDN VOUT = 2.8V C OUT= 1F Ceramic C BYP = 470pF I OUT= 100A 50mV / DIV V OUT V OUT 2V / DIV Input Voltage 6V V IN = 4.0V VOUT = 3.0V C OUT = 10F C BYP = 0.01F I OUT = 100A 4V (c) DS21663B-page 8 2002 Microchip Technology Inc. TC2054/2055/2186 TYPICAL CHARACTERISTICS (CONT) FIGURE 5-19: VOUT TO ERROR DELAY RPULLUP = 100k IOUT = 0.3mA VIN 1V/Div 2.8V VOUT 1V/Div 2.8V 3.0V 3.42V VERROR 2V/Div 0V 2002 Microchip Technology Inc. DS21663B-page 9 (c) TC2054/2055/2186 6.0 6.1 PACKAGING INFORMATION Package Marking Information 5-Pin SOT-23A 1 & 2 = part number code + temperature range and voltage (V) 1.8 2.5 2.7 2.8 2.85 3.0 3.3 TC2054 Code SA SB SC SD SE SF SG TC2055 Code TA TB TC TD TE TF TG TC2186 Code VA VB VC VD VE VF VG 3 represents year and 2-month period code 4 represents lot ID number 6.2 Taping Information Component Taping Orientation for 5-Pin SOT-23A (EIAJ SC-74A) Devices User Direction of Feed Device Marking W PIN 1 Standard Reel Component Orientation TR Suffix Device (Mark Right Side Up) P Reverse Reel Component Orientation RT Suffix Device (Mark Upside Down) Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 5-Pin SOT-23A 8 mm 4 mm 3000 7 in (c) DS21663B-page 10 2002 Microchip Technology Inc. TC2054/2055/2186 6.3 Package Dimensions SOT-23A-5 .075 (1.90) REF. .122 (3.10) .098 (2.50) .020 (0.50) .012 (0.30) PIN 1 .122 (3.10) .106 (2.70) .057 (1.45) .035 (0.90) .006 (0.15) .000 (0.00) .071 (1.80) .059 (1.50) .037 (0.95) REF. 10 MAX. .024 (0.60) .004 (0.10) .010 (0.25) .004 (0.09) Dimensions: inches (mm) 2002 Microchip Technology Inc. DS21663B-page 11 (c) TC2054/2055/2186 NOTES: (c) DS21663B-page 12 2002 Microchip Technology Inc. TC2054/2055/2186 SALES AND SUPPORT Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2002 Microchip Technology Inc. DS21663B-page 13 TC2054/2055/2186 NOTES: DS21663B-page 14 2002 Microchip Technology Inc. Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, FilterLab, KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER, PICSTART, PRO MATE, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company's quality system processes and procedures are QS-9000 compliant for its PICmicro (R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001 certified. 2002 Microchip Technology Inc. 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Room 701, Bldg. B Far East International Plaza No. 317 Xian Xia Road Shanghai, 200051 Tel: 86-21-6275-5700 Fax: 86-21-6275-5060 Kokomo 2767 S. Albright Road Kokomo, Indiana 46902 Tel: 765-864-8360 Fax: 765-864-8387 France Microchip Technology SARL Parc d'Activite du Moulin de Massy 43 Rue du Saule Trapu Batiment A - ler Etage 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Los Angeles 18201 Von Karman, Suite 1090 Irvine, CA 92612 Tel: 949-263-1888 Fax: 949-263-1338 China - Shenzhen Microchip Technology Consulting (Shanghai) Co., Ltd., Shenzhen Liaison Office Rm. 1315, 13/F, Shenzhen Kerry Centre, Renminnan Lu Shenzhen 518001, China Tel: 86-755-2350361 Fax: 86-755-2366086 New York 150 Motor Parkway, Suite 202 Hauppauge, NY 11788 Tel: 631-273-5305 Fax: 631-273-5335 Germany Microchip Technology GmbH Gustav-Heinemann Ring 125 D-81739 Munich, Germany Tel: 49-89-627-144 0 Fax: 49-89-627-144-44 San Jose Microchip Technology Inc. 2107 North First Street, Suite 590 San Jose, CA 95131 Tel: 408-436-7950 Fax: 408-436-7955 Hong Kong Microchip Technology Hongkong Ltd. Unit 901-6, Tower 2, Metroplaza 223 Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Italy Microchip Technology SRL Centro Direzionale Colleoni Palazzo Taurus 1 V. Le Colleoni 1 20041 Agrate Brianza Milan, Italy Tel: 39-039-65791-1 Fax: 39-039-6899883 Toronto 6285 Northam Drive, Suite 108 Mississauga, Ontario L4V 1X5, Canada Tel: 905-673-0699 Fax: 905-673-6509 India Microchip Technology Inc. India Liaison Office Divyasree Chambers 1 Floor, Wing A (A3/A4) No. 11, O'Shaugnessey Road Bangalore, 560 025, India Tel: 91-80-2290061 Fax: 91-80-2290062 United Kingdom Arizona Microchip Technology Ltd. 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44 118 921 5869 Fax: 44-118 921-5820 03/01/02 (c) DS21663B-page 16 *B36612SD* 2002 Microchip Technology Inc. |
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